Lidrotec GmbH

Lidrotec GmbH

Highest quality wafer dicing. #LiterallyCuttingEdge

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Industry
Industrial Machinery Manufacturing
Company size
52 people
Headquarters
Bochum, North Rhine-Westphalia
Type
Privately Held
Total funding
$19.8M

Material processing with ultrashort laser pulses is currently one of the most innovative production and manufacturing processes, and allows high-precision cutting, drilling and structuring of a wide variety of materials. We aim to expand the application potential of ultrashort pulse laser processing through an innovation: We efficiently use liquids in the laser processing zone, which greatly cools the workpiece and removes ablation products such as particles. As a result, the processing speed can be increased whilst maintaining high precision and achieving significantly cleaner surfaces. Using our years of experience in the field of micromachining with ultrashort pulse lasers in liquids, we are currently working on building a robust industrial laser system. The implementation of this project is supported by the funding of the „EXIST-Forschungstransfer“ (BMWi).

Semiconductor Industrial Manufacturing Manufacturing

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