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Infineon

Project Manager Package Development 5809

Infineon · Wuxi City, Jiangsu, China

Semiconductor Manufacturing · 10,001+ employees

Jun 05
Principal (10+ yrs) Full-time China
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About the role

The Project Manager is responsible for planning, managing, and driving the timely completion of new package and product derivative projects. They must ensure project success by managing scope, budget, quality, and delivery while setting up appropriate team structures and mitigating risks.

What they look for

Project Management Semiconductor Assembly Packaging Development Risk Management Strategic Thinking Negotiation Budgeting Mechanical Engineering Electrical Engineering Electronics Engineering Material Science Metallurgical Engineering Cross-functional Communication Document Compilation Presentation Skills

Requirements

Candidates must hold a Bachelor or Master’s degree in Engineering or a related discipline and possess at least 10 years of experience in semiconductor assembly and packaging development. Strong project management skills, strategic thinking, and proficiency in English for cross-functional communication are required.

Full description

To plan, manage and drive timely completion of projects including new package & product derivates ramp up, in order to ensure success in meeting project deliverable in time, scope and budgets.

Your roleKey responsibilities in your new role

  • To plan, manage and drive timely completion of projects including new package & product derivates ramp up, in order to ensure success in meeting project deliverable in time, scope and budgets
  • Responsible for the project’s success (scope, budget, time, quality, delivery)
  • To drive and manage project business case
  • To setup appropriate project team structure
  • Define target and deliverables for the projects and all related sub-projects (if applicable)
  • Plan and execute mitigating measures with respect to identified /potential project risks

Your profileQualifications and skills to help you succeed

  • Bachelor or Master’s Degree in Mechanical, Electrical or Electronics Engineering, Material Science, Metallurgical Engineering or a related discipline
  • At least 10 years of working experience in semiconductor assembly and packaging development and experience in Project Management(preferably in the field of semiconductor industry, BE Assembly/Test)
  • Knowledge in semiconductor BE assembly / test industry
  • Fundamental knowledge in Project Management (planning, risk management, consolidation, negotiation)
  • Knowledge in technical and cost interrelations/ correlations
  • Presentation and document compilation skills
  • Negotiation skills and strategic thinking
  • Competent in daily oral & written English for cross-functional and overseas communication

#WeAreIn for driving decarbonization and digitalization.As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.Are you in?We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.

Sharon Zhou

https://jobs.infineon.com/minfang.zhou@infineon.cn