Mechanical Engineer, Data Systems Hardware
Meta Pittsburgh, Pennsylvania, United States · $173K–$245K/yr
Software Development · 10,001+ employees
About the role
The Mechanical Engineer will lead the architecture and design of wearable data collection hardware, managing the process from concept through deployment. This role involves integrating complex sensor systems into wearable form factors while ensuring participant comfort, safety, and sensor alignment.
What they look for
Requirements
Candidates must have a Bachelor's degree in Mechanical Engineering and at least 8 years of experience in electromechanical product development. Proficiency in 3D CAD software and experience taking hardware from concept to production are essential.
Benefits
Full description
Reality Labs is seeking an Mechanical Engineer to lead the design of internal data collection hardware. The Data Systems Hardware & Operations team designs, builds, and deploys the devices and systems used to capture the datasets behind Reality Labs products. This work spans development of data collection headsets and wearable prototypes, sensor-integrated form factor mockups, and the necessary infrastructure to integrate these systems into data collection operations. These systems support Codec Avatars, Input, and Health programs across all Reality Labs devices, and enable the algorithm development and research behind those programs.
This role owns mechanical architecture and design for data collection devices from concept through deployment to collection sites. Design work centers on head-worn and body-worn prototypes: integrating sensors (cameras, IMU, audio, etc.), illumination, and data aggregation into wearable form factors, holding sensor alignment and repeatable positioning across participants, managing thermal and mass distribution under wear constraints, and meeting fit, comfort, and participant safety requirements across a range of head and body geometries. Prototypes must be durable enough for sustained use by non-engineering operators and serviceable in the field.
The role operates across mechanical, optical, electrical, systems, and firmware boundaries, and partners with research, program management, and data collection operations.
Full system requirements are often undefined at project start. Research direction and program priorities shift, and requirements are established through prototyping and measurement. Candidates should have experience working in high-ambiguity, fast-paced development environments.
Responsibilities
- Own mechanical architecture and design for data collection headsets, wearable prototypes, and the infrastructure necessary to integrate them into data collection operations
- Design head-worn and body-worn hardware that integrates sensors (cameras, IMU, audio, etc.), illumination, and data aggregation into wearable form factors while meeting sensor alignment, fit, comfort, mass distribution, and thermal requirements
- Provide start-to-finish ownership of mechanical design and implementation, partnering with internal stakeholders (electrical, firmware, systems engineering, program management, and operations) and external stakeholders (production engineering, supply chain) to deliver devices on schedule and to specification
- Translate research and program roadmaps into mechanical system requirements, and convert prototyping and test findings into documented specifications
- Define and communicate system-level trade-offs across performance, cost, manufacturability, wearability, deployability, schedule, and risk to align cross-functional stakeholders and leadership
- Design for sensor location repeatability across participants and sessions, including adjustment mechanisms, sizing strategies, and fit across a range of head and body geometries
- Take data collection concepts from early prototypes and proof-of-concept builds through to replicable devices deployed across multiple collection sites
- Build and iterate rapidly, running build, measure, and revise cycles to resolve open technical questions and establish requirements
- Support prototype fabrication and builds, working with internal and external partners on part fabrication, fixture and assembly tooling design, and assembly procedures
- Design test fixtures, calibration fixtures, and capture support hardware required to characterize and validate data collection devices
- Define and execute test and validation plans, including measurement, data analysis, and refinement of design assumptions
- Design for transport, field assembly, and reconfiguration across distributed collection sites, and support device bring-up and troubleshooting on site
- Establish mechanical design standards, common platforms, and reusable subsystems to reduce the cost and schedule of subsequent device builds
- Perform root-cause analysis on electromechanical failures in deployed hardware, implement design improvements, and verify effectiveness
- Create and maintain assembly instructions, fit and donning procedures, test procedures, maintenance logs, and design rationale documentation to support repeatable builds and handoff to partner teams
- Balance and sequence mechanical work across Codec Avatars, Input, and Health programs with competing timelines and resource needs
Minimum Qualifications
- Bachelor's degree in Mechanical Engineering or a related engineering discipline, or equivalent industry experience
- 8+ years of experience in mechanical design and development of electromechanical products or devices
- Experience with 3D CAD, including Siemens NX or SOLIDWORKS
- Experience owning mechanical design of a device or system from concept through production or deployment
- Experience designing hardware that integrates cameras, sensors, electronics, or compute into constrained form factors
- Experience with precision mechanical design, including tolerance stack-up analysis and alignment-critical assemblies
- Experience defining and executing mechanical test plans, including fixture design, measurement, and data analysis
- Experience with fabrication processes including CNC machining, injection molding, sheet metal, and additive manufacturing, and with design-for-manufacturing practices
- Experience working cross-functionally with electrical, firmware, and systems engineering partners
- Experience establishing requirements and specifications in environments where full system requirements are undefined at project start
Preferred Qualifications
- Master's degree in Mechanical Engineering or a related discipline, or equivalent industry depth
- Experience with systems engineering methods, including requirements management, interface control, trade studies, and risk and FMEA analysis
- Experience designing hardware for repeated handling, transport, and field deployment by non-engineering operators
- Experience with motion capture, photogrammetry, or biometric sensing systems
- Experience adhering to and implementing responsible, ethical AI practices (e.g., risk assessment, bias mitigation, quality and accuracy reviews)
- Experience taking novel technology from investigation through production transfer, including new technology introduction and new product introduction processes
- Experience with instrumented prototypes or research hardware built for data capture rather than for production release
- Experience with AR/VR headsets, smart glasses, or other head-mounted hardware
- Experience serving as technical lead across engineering disciplines and driving projects cradle to grave
- Experience designing head-worn, wearable, or body-worn devices, including fit, comfort, adjustment mechanisms, and anthropometric sizing
- Demonstrated ongoing AI skill development (e.g., prompt/context engineering, agent orchestration) and staying current with emerging AI technologies
- Demonstrated ability to integrate AI tools to optimize/redesign workflows and drive measurable impact (e.g., efficiency gains, quality improvements)
- Python or equivalent scripting experience for test automation and data collection
- Experience with privacy, data compliance, and participant safety requirements in human subject study environments
- Thermal design experience for dense electronics or compute in wearable or enclosed assemblies
- Experience with structural and thermal analysis methods, including FEA correlation, load testing, and drop or durability testing
- Experience supporting research or data collection operations teams
- Experience with camera and sensor integration, including optical and sensor alignment, mounting strategy, and calibration fixture design
- Experience with contract manufacturing across design, manufacture, test, and delivery of hardware
$173,000/year to $245,000/year + bonus + equity + benefits