Manager of Process Integration Engineering
Skorpios Technologies, Inc. Temecula, California, United States · $190K–$225K/yr
Telecommunications · 51-200 employees
About the role
The Manager of Process Integration Engineering leads the integration team to drive revenue targets through complex R&D projects, technology transfers, and yield improvements. This role serves as the primary technical interface for customers, overseeing fab solutions from prototyping to high-volume manufacturing.
What they look for
Requirements
Candidates must hold a Master’s or Ph.D. in a relevant engineering or science discipline with at least 8 years of industrial semiconductor fab experience. Proven leadership in project management and deep technical expertise in front-end processes and statistical methodologies are required.
Full description
Description
Position Overview
The Manager of Process Integration Engineering leads the Integration engineering team and the department efforts to achieve or exceed revenue targets. Leads complex R&D projects related to incoming technology transfer, productization, new product introductions, yield improvement, cycle time reductions and other improvements. Engages directly with customers to guide Skorpios efforts specific to the project.
Position Overview
The Director of Process Integration Engineering leads the Integration and Technology Transfer team in executing fab solutions across two core business pillars: specialty test wafer manufacturing and comprehensive foundry services for external fabless partners. This role directs customer technology execution, incoming process transfers, yield ramps, and cycle time reductions, serving as the lead technical authority and primary interface for commercial clients. The Director directly impacts top-line revenue by establishing robust, repeatable manufacturing solutions that take customer designs from early prototyping to high-volume manufacturing (HVM).
Key Responsibilities
Reasonable accommodations may be made to enable individuals with disabilities to perform these essential responsibilities.
- Customer Co-Development & Technical Governance: Act as the primary technical interface for external fabless customers, translating device architectures and milestone requirements into actionable process flows and objective engineering specifications.
- Technology Execution & Transfer: Oversee incoming technology transfer, prototyping, productization, and yield ramps for multi-client foundry programs and specialized test wafer offerings.
- Revenue & Operational Delivery: Direct departmental engineering initiatives to meet or exceed company revenue goals by hitting customer milestones, accelerating fab cycle times, and maximizing wafer output yields.
- Process Module Integration: Define Objective Specification documents, formulate complex Design of Experiments (DOE), and implement Statistical Process Control (SPC) methods to develop and qualify macro modules across CVD, PVD, Etch, Wet Cleans, Photolithography, and CMP.
- Inline Metrology & Parametric Correlation: Correlate final device parameters with inline fab metrology, defect inspections, and process metrics to accelerate root-cause failure analysis (FA) and continuous yield improvements.
- Cleanroom Problem Solving: Participate in and direct hands-on cleanroom inspections for critical excursions, complex tool/process interactions, and cross-contamination prevention in a multi-tenant environment.
- Cross-Functional Orchestration: Lead and influence cross-functional operations, process engineering, and equipment teams without direct authority to align priorities, resolve operational bottlenecks, and safeguard project delivery schedules.
Supervisory & People Responsibilities
- Directly lead, mentor, and evaluate the Process Integration and Technology Transfer team.
- Oversee talent acquisition, onboarding, technical skill advancement, resource allocation, and individual performance management.
- Establish clear accountability and project milestones across multiple concurrent external accounts.
Requirements
Education: Master’s or Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or related discipline.
- Experience: 8+ years of industrial semiconductor or MEMS-based fab integration experience spanning a broad range of applications and front-end processes (Lithography, Dry/Wet Etch, CMP, Thin Films/PVD/CVD).
- Leadership: Proven project management expertise and engineering team leadership, with a track record of driving complex customer-facing R&D initiatives to completion.
- Technical Depth: In-depth knowledge of process mixing, cross-contamination control, Failure Mode and Effects Analysis (FMEA), defect analysis, and statistical methodology (DOE, SPC).
- Customer Interfacing: Demonstrated success engaging directly with commercial customers, managing project reviews, and delivering on technical and tactical commitments.
