Vice President, Platform Solutions Architect
International Recruiting LLC California, United States
About the role
The Vice President of Platform Solutions Architect will own the end-to-end SoC architecture for AI infrastructure silicon, from system-level definition to full-chip integration. They will lead cross-functional teams to manage PPA tradeoffs, verification, and customer-facing technical engagements.
What they look for
Requirements
Candidates must have 15+ years of experience in semiconductor architecture or SoC design, with at least 5 years in senior technical leadership. A proven track record of leading multidisciplinary teams and translating complex chip architecture into deployable customer solutions is required.
Full description
What You Will Build
SoC & System Architecture
- Own the end-to-end SoC architecture for our client's AI infrastructure silicon, from system-level
definition through block-level tradeoffs and full-chip integration
- Lead cross-block system architecture and PPA (power, performance, area) tradeoffs, driving
performance modeling that ties chip-level decisions to real workload requirements
- Set architectural direction for the AI compute engine and its integration with the broader SoC,
in partnership with the team’s AI and system architecture leads
Interconnect, Memory & I/O Architecture
- Direct on-chip interconnect and coherency fabric architecture (NoC topology, protocol) to meet
bandwidth and latency requirements across compute, memory, and I/O
- Own memory subsystem architecture — on-die SRAM, external memory, and expansion
interfaces — sized and tiered to the demands of large-model inference workloads
- Guide I/O architecture and offload engine design, ensuring the platform integrates cleanly into
customer server and rack architectures
Verification, Signoff & Physical Integrity
- Own signoff across the entire SoC: functional verification strategy and coverage closure,
physical verification (DRC/LVS, timing), and signal and power integrity
- Build the verification and signoff cadence — design reviews, formal methods, coverage gates
— that catches issues early rather than at final tape-out
- Own power architecture and intent (UPF) across the chip, balancing performance targets
against thermal and power delivery constraintsCustomer Solutions & Product Engineering
- Translate SoC architecture into end solutions for customers: reference designs, system-level
integration guidance, and technical engagement through early customer programs
- Partner with the Product Engineering team on manufacturability, yield, and chip-level security
considerations from architecture definition through production
- Represent the architecture team in customer-facing technical discussions, ensuring platform
capabilities are communicated clearly to hyperscale infrastructure teams
What We Are Looking For
Required Experience
- 15+ years in semiconductor architecture or SoC design, with at least 5 years in senior
technical leadership owning full-chip architecture
- Demonstrated ownership of SoC architecture end-to-end: system definition, cross-block PPA
tradeoffs, and signoff through tape-out
- Experience building and leading multidisciplinary architecture teams spanning system
architecture, interconnect, memory, verification, and physical design
- Track record of translating chip architecture into deployable solutions for external customers,
not just internal specs
Strongly Preferred
- Architecture experience with AI/ML accelerators, inference-optimized SoCs, or datacenter-
class compute silicon
- Experience with memory subsystem architecture for large-model or high-bandwidth workloads
(tiered memory, coherency, capacity/bandwidth scaling)
- Experience serving hyperscale cloud or datacenter infrastructure customers, and
understanding of their technical evaluation and adoption process
- Familiarity with RISC-V or other open ISAs, and with confidential computing / secure
execution as it relates to silicon architecture
- Experience managing the interface to external back-end design and foundry partners,
including netlist quality, DFT, and signoff handoff
Leadership Qualities
- Operates as the final technical authority across the SoC: comfortable making binding
architecture decisions and defending them under scrutiny
- Can lead senior, specialized architects (system, interconnect, memory, verification) without
being the bottleneck — empowers depth while holding a coherent architectural vision
- Strong communicator across technical and business audiences; able to represent the platform
directly to hyperscale customer engineering teams
- High tolerance for greenfield ambiguity and startup pace; builds structure and process where
none currently exists, without slowing the team down
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