Nokia

Electrical CM Support Engineer - Operations Engineering Team

Nokia India

Telecommunications · 1,001-5,000 employees

6 h ago Closes in 3d
support-engineer Senior (5-10 yrs) Full-time India
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About the role

You will develop, optimize, and qualify advanced electronic manufacturing processes including SMT, laser soldering, and flip-chip assembly. Additionally, you will lead failure analysis and root-cause investigations to drive yield improvement and ensure product reliability.

What they look for

SMT assembly Reflow soldering Thermal profiling Advanced PCB technologies Laser soldering Flip-chip assembly Underfill Die attach X-ray inspection Cross-section analysis Failure analysis Root-cause investigation Design for Manufacturing Design for Assembly Design for Reliability Semiconductor packaging

Requirements

Candidates must hold a BS, MS, or PhD in Electrical, Electronics, Manufacturing Engineering, or Materials Science. Strong expertise in electronics manufacturing, advanced PCB technologies, and failure analysis techniques is required.

Benefits

Flexible and hybrid working arrangements Medical insurance Health check-ups Life and accident insurance Well-being programs Maternity and paternity leave Personal support service Career growth and mobility Continuous learning Technical certifications Mentoring programs Coaching Digital learning platforms Recognition programs Ergonomic working support Mobile device programs

Full description

Join our Engineering Operations Team as an Electrical CM Support Engineer, where you will be responsible for developing, qualifying, and sustaining advanced assembly and interconnect processes used in high-performance electronic products. You will work across the entire product lifecycle, from New Product Introduction (NPI) through volume manufacturing, driving process optimization, yield improvement, and root cause analysis.

In this role, you will support complex assembly technologies including SMT, fine-pitch PCBA, organic and mSAP-based substrates, reflow soldering, hot bar soldering, laser soldering, flip-chip assembly, and advanced packaging solutions. You will leverage inspection and analytical techniques such as X-ray analysis, cross-sectioning, microscopy, and reliability testing to ensure robust manufacturing processes and superior product quality. Our collaborative environment encourages innovation, technical leadership, and continuous improvement while solving challenging manufacturing problems.

NI Lightpath

Responsibilities

  • Develop, optimize, and qualify SMT, through-hole, laser soldering, hot bar soldering, flip-chip, underfill, die attach, and advanced packaging processes.
  • Define and maintain robust process windows for reflow soldering and advanced electronic assembly technologies.
  • Support New Product Introduction (NPI) from prototype builds through high-volume manufacturing.
  • Conduct process characterization, Design of Experiments (DOE), and process capability studies.
  • Lead failure analysis and root-cause investigations using X-ray, cross-sectioning, microscopy, and electrical characterization.
  • Perform cross-sectional analysis to assess solder joint integrity, PCB structures, and manufacturing defects.
  • Drive yield improvement, quality enhancement, process optimization, and cost reduction initiatives.
  • Collaborate with design teams to ensure Design for Manufacturing (DFM), Design for Assembly (DFA), and Design for Reliability (DFR).
  • Develop manufacturing specifications, work instructions, control plans, process documentation, and qualification reports.
  • Work closely with suppliers, contract manufacturers, and factory teams for reliability testing and production readiness.

Qualifications

  • BS/MS/PhD in Electrical, Electronics, Manufacturing Engineering, Materials Science, or related field
  • Strong expertise in electronics manufacturing, SMT assembly, reflow soldering, thermal profiling, and advanced PCB technologies.
  • Hands-on experience with advanced interconnect and packaging technologies (laser soldering, flip-chip, underfill, die attach).
  • Proven capability in X-ray inspection, cross-section analysis, solder joint characterization, and failure/root-cause investigations.
  • Experience with semiconductor packaging, silicon photonics, RF/optical modules, advanced failure analysis techniques (e.g., SEM, EDS, FIB), and familiarity with Industry 4.0/automation.

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Advancing connectivity to secure a brighter world.

Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world.

Learn more about life at Nokia.

Our recruitment process

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.

Some of our benefits in India:

  • Flexible and hybrid working arrangements to support work–life balance
  • Health and well-being support – medical insurance for you and your family, health check-ups, life and accident insurance, well-being programs, and employee resource groups
  • A minimum of 90 days of Maternity and Paternity Leave based on eligibility
  • Personal Support Service 24/7 – a confidential support channel open to all Nokia employees and their families in challenging situations
  • Career growth & mobility – technical career paths, job rotations, international assignments, and relocation support
  • Continuous learning – technical certifications, mentoring programs, coaching, and digital learning platforms
  • Opportunities to innovate and contribute through Nokia’s research and development environment
  • Recognition programs that celebrate outstanding contributions
  • Workplace support – ergonomic working support and mobile device programs based on eligibility

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