Wireless Silicon Debug and Characterization Engineering Manager

Apple's wireless silicon team builds highly energy-efficient wireless chips that connect hundreds of millions of customers to the world around them. The team spans RF and analog design, PHY and MAC systems, test and validation, and firmware, and works on every stage from first silicon to mass production.

In this role, you'll build and lead a small engineering team with RF, PHY/wireless system, and firmware expertise. You'll stay hands-on in the lab, bringing up and debugging new silicon and improving calibration and trim, so that wireless products perform at their best when they reach customers.

Description

You'll lead a team that brings up, characterizes, debugs, calibrates, and trims wireless SoCs from first silicon through mass production. The team solves problems that span PHY algorithms, RF circuits, firmware, and test setup. When module or system production issues involve the wireless SoC, the team provides silicon-level root-cause analysis to the manufacturing support teams.

Minimum Qualifications

Bachelor's degree in Electrical Engineering or a related field, and 10+ years of relevant industry experience. Experience leading engineers or technical teams. Experience in wireless system design, integration, or bring-up of wireless silicon. Experience in RF test development, hands-on debug, performance characterization, and reporting. Experience with RF, PLL, and wireless system measurements (e.g., IP3, NF, ACPR, phase noise, lock time) using network analyzers, spectrum analyzers, vector signal analyzers, and signal generators. Experience writing scripts in Python, Perl, TCL, C++, or similar languages to automate test equipment and data analysis. Proficiency in Mandarin and English.

Preferred Qualifications

MS or PhD in Electrical Engineering or Computer Engineering. Experience bringing up radio calibration algorithms such as power control, IQ imbalance, LO leakage, or TSSI. Knowledge of wireless communication protocols (802.11a/b/g/n/ac/ax/be, Bluetooth, or UWB) at the MAC/PHY level. Experience with embedded firmware (C, ARM CPUs, RTOS), including low-level drivers, diagnostics, and manufacturing test software. Ability to bring engineers from different disciplines together to solve cross-layer problems as one team. Ability to communicate complex technical findings clearly, in writing and in person, to cross-functional teams across time zones. Track record of developing engineers' technical skills and growing team capability. Ability to balance hands-on technical work with team leadership and shifting priorities.